11th Gen Intel® Core™ U-Series processors (up to 28 W TDP)
Intel® Celeron® 6000 Series processors (15 W TDP)
2x DDR4 SO-DIMM memory socket
2x DP, 1x LVDS for video support
1x 2.5 GbE LAN, 1x GbE LAN for Ethernet
4x USB 3.1, 4x USB 2.0 for USB device connection
2x RS232/422/485 for serial device connection
8-bit DIO for device / signal control
1x SATA 3.0 for storage device
1x M.2 Key B, 1x M.2 Key M, 1x M.2 Key E for SSD, WLAN, WWAN or other possible expansion
1x B2B connector for extended I/Os: DDI, DDP, PCIe x2, PCIe x1, SM Bus, I2C, UART, GSPI
TPM 2.0 support
Extreme temperature model available: -40 °C ~ 85 °C

Description

Ideal for AI / Deep Learning Applications

3.5″-SBC-TGL is a 3.5″ single board computer powered by 11th Generation Intel® Core™ U-Series and Celeron® 6000 Series processors (codenamed Tiger Lake UP3) integrated with Intel’s next-generation Iris® Xe Graphics. It delivers massive improvements in processing, graphics and AI performance, ideal for AI, deep learning and similar applications that demand high-speed processing, computer vision and low-latency deterministic computing.

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8K Ultra HD Video Outputs

The board supports up to two 8K video streams at 60 fps. Via the extended B2B connector, it can support four channels of DP signal outputs to drive four independent displays running 4K video at 60 fps and thus it can be integrated into a 2 x 2 or 4 x 1 video wall system.

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Optimized Bandwidth Utilization

In addition to a GbE LAN port, the 3.5″-SBC-TGL offers another 2.5 GbE LAN port to satisfy the growing bandwidth-intensive needs, enabling faster networking, smoother multimedia playback, web-/cloud-based services and daily usage.

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Flexibility In System Design & Performance

In addition, the board supports configurable TDP done via BIOS settings, which provides flexibility to integrators to design a system according to the cooling techniques they use and the application scenarios they target.

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Harsh Environment Applications Possible

The 3.5″-SBC-TGL offers variants with industrial-grade operating temperature range from -40 °C to 85 °C, allowing integrators to develop a robust system installed in an extreme-temperature environment.